The report also discusses in detail the recent mergers and acquisitions, joint ventures, collaborations, product launches and brand promotions, agreements, corporate and government deals, and partnerships, among others. The report also sheds light on the recent technological developments and product advancements in the Radiation Hardened Electronics Market. The competitive landscape of the report has been formulated by considering all the vital parameters such as company profiling, market share, recent developments and advancements, gross margins, product portfolio, revenue generation, financial standing, market position, and expansion plans.
The Global Radiation Hardened Electronics (RHE) market size was USD 1.48 billion in 2021 and is expected to register a revenue CAGR of 3.9% during the forecast period, according to the latest analysis by Emergen Research. Rising demand for low-cost nanosatellites and communication satellites and increasing intelligence, surveillance, and reconnaissance operations due to growing hostility among nations are factors driving market revenue growth between 2022 and 2030. Currently, increasing number of commercial space operations have led to growing demand for radiation-hardened power management systems.
In addition, rapid integration of advanced technologies for electronics in spacecraft and rising usage of low-cost nanosatellites are expected to increase demand for radiation hardening electronics in space programs. According to reports, around 64 countries have already launched their nanosatellites or CubeSats and by 2019 there were around 1,186 nanosatellites launched, which have increased in number in recent times.
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Market Scope: The report explains the scope of various commercial possibilities in the global Radiation Hardened Electronics market over the upcoming years. The estimated revenue build-up over the forecast years has been included in the report. The report analyses the key market segments and sub-segments and provides deep insights into the market to assist readers with the formulation of lucrative strategies for business expansion.
Some Key Highlights from the Report
Major companies in the market report include Micropac Industries Inc., BAE Systems Plc., Honeywell International Inc., ST Microelectronics N.V., Microchip Technology Inc., Solitron Devices Inc., Cobham Limited, pSemi Corporation, Infineon Technologies AG, and Renesas Electronics Corporation.
Market Taxonomy:
Chapter 1: Methodology & Scope
Chapter 2:
Executive Summary
Chapter 3:
Industry Insights
Chapter 4:
Company Profile
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Emergen Research has segmented the global radiation hardened electronics market based on manufacturing technique, product type, component type, application, and region:
· Manufacturing Technique Outlook (Revenue, USD Billion; 2019-2030)
· Product Type Outlook (Revenue, USD Billion; 2019-2030)
· Component Type Outlook (Revenue, USD Billion; 2019-2030)
· Application Outlook (Revenue, USD Billion; 2019-2030)
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Geographical Segmentation:
The latest research report entails an in-depth analysis of the current growth opportunities for various regions of the Radiation Hardened Electronics Market, gauging their revenue share over the forecast timeline. Furthermore, the report analyses the year-on-year growth rate of these regions over the forecast duration. The leading market regions profiled in the report are North America, Europe, Asia Pacific, Latin America, and Middle East & Africa.
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